B60/C60 Series Datasheet

Heat Sink System

Ohmite introduces the powerful B60/C60 series heatsink with cam clip (Pat.Pending) or custom mounting. This series offers flexible, high performance and compact heat sink with exchangeable cam clip system for TO-247 and TO-264 devices. The built in lip is provided for mounting ease. The optional B series can be tapped for popular Ohmite resistors or other devices. These powerful heat sinks can be thru-hole soldered as a single or dual unit. The dual unit can be mated to a 60mm fan for greater thermal performance. It is the ideal type of heat sink for high power density and small size (3U or 4U) electronic packaging with forced convection.

Series Specifications

Surface Area(in2/mm2):

177 / 114,300

Weight(oz/g):

5.7 / 163

Length L(mm):

75

Surface Area(in2/mm2):

-

Weight(oz/g):

-

Length L(mm):

-

Surface Area(in2/mm2):

177 / 114,300

Weight(oz/g):

5.7 / 163

Length L(mm):

75

Surface Area(in2/mm2):

-

Weight(oz/g):

-

Length L(mm):

-

*Consult factory for alternate lengths and clip combinations

Characteristics

Aluminum Alloy 6063-T5 or Equivalent with either degreased or black anodized finish.

Music Wire, Per ASTM A228 with bright nickel plating

Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike. RoHS compliant.

60mm fan with 4 self-tapping M3.5 screws

For improvement, use thermal joint compound, 0.005 Grafoil (TGon 800 by Laird), or phase change material (Hi-Flow by Bergquist) Insulator (Optional) Sil-Pad 900-S, K6 800-S and K10 by Bergquist