Ohmite D Series heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The unique design (Patent Pending) combines tin plated, solderable rods with an aluminum extruded heat sink body. These rods (or “rollers”) are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. Specifically designed for use with the increasingly popular TO-252, TO-263 and TO-268 packages, the D Series affords the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal “bottle-neck” is also eliminated, while surface area for cooling is maximized with the extruded fins of the D Series body.
Features
- Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets.
- Light weight aluminum construction allows faster pick and place assembly reducing the manufacturing cycle time.
- Radius mounted “Rollers” are designed for maximizing heat transfer from the component and avoiding the thermal “bottle-neck” seen in stamped and staked heatsinks.
- Available in tape and reel (200 or 250 based on part series).
- RoHS Compliant
Heat Dissipation
Final thermal performance is highly dependent on the thermal characteristics of the PCB. It is possible to see a 50% drop in temp rise in natural convection with a thermally improved PCB.
Dimensions
Style 10
Style 20
Style 30
Style 40
Land Patterns
Land Patterns for D, D2 and D3
Tape and Reel
Reel diameter: 13.00” (330.00mm)
200 pcs per reel- 20, 30 and 40 series
250 pcs per reel- 10 series
Removable Kapton tape on each part facilitates handling by automatic pick and place equipment. Style 10 tape and reel only.
Ordering Information
