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AS Series Datasheet

Anti-surge Thick Film Chip Resistors 

Res AS Smd product image

 

Applications

  • Small size and light weight
  • Suitable for both wave and reflow soldering
  • Can withstand high surge
  • Reduction of assembly costs

Sereis Specifications

Power Rating at 70°C:

0.33W

Max Working Voltage:

150V

Max Overload Voltage:

300V

Dielectric Withstanding Voltage:

500V

Resistance Range:

1Ω~10MΩ

Power Rating at 70°C:

0.5W

Max Working Voltage:

200V

Max Overload Voltage:

400V

Dielectric Withstanding Voltage:

500V

Resistance Range:

1Ω~10MΩ

Power Rating at 70°C:

1.5W

Max Working Voltage:

500V

Max Overload Voltage:

500V

Dielectric Withstanding Voltage:

500V

Resistance Range:

1Ω~20MΩ

Characteristics

-55°C ~ +155°C

E-24 values

Thick film

Silver, copper, nickel, and tin, non-SAC alloy

Matte tin

±5% standard; ±10% and ±20% available

ΔR:

1Ω-10Ω: ≤ ±400PPM/°C (±200 PPM can be provid-ed on a case to case basis)11Ω-10MΩ: ≤ ±100PPM/°C

Test Methods (JIS C 5201-1 ):

Natural ΔR/°CR2-R1 x 106 (PPM/°C)R1(t2-t1)R1: at room temp. (T1)R2: at room temp. plus 100°C (T2)Test pattern: room temp. (T1), room temp. +100°C(T2)

ΔR:

±(1.0% + 0.1Ω) max.

Test Methods (JIS C 5201-1 ):

Permanent ΔR after the application of a potential of 2.5 times RCWV for 5 sec.

ΔR:

±(1.0% + 0.05Ω) max.

Test Methods (JIS C 5201-1 ):

Twist of Test Board: Y/X = 3/90 mm for 60 sec0

ΔR:

±(1.0% + 0.05Ω) max.

Test Methods (JIS C 5201-1 ):

260°C±3°C for 10 ±1 sec.

ΔR:

±(1.0% + 0.1Ω) max.

Test Methods (JIS C 5201-1 ):

See graph on next page.

ΔR:

±(3.0% + 0.1Ω) max.

Test Methods (JIS C 5201-1 ):

Temporary ΔR after 240 hr. at 40 ±2°C and 90-95% relative humidity

ΔR:

±(3.0% + 0.1Ω) max.

Test Methods (JIS C 5201-1 ):

ΔR after 1,000 hr. (1.5 hr. "on", 0.5 hr. "off" ) at RCWV at 40 ±2°C and 90-95% relative humidity

ΔR:

±(3.0% + 0.1Ω) max.

Test Methods (JIS C 5201-1 ):

ΔR change after 1,000 hr. operat-ing at RCWV, with duty cycle of (1.5 hours"on", 0.5 hour"off") at 70°C ±2°C ambient

ΔR:

Min. 95% coverage

Test Methods (JIS C 5201-1 ):

Wave Solder: 245°C ±3°C for 2-3 sec.

ΔR:

±(1.0% + 0.05Ω) max.

Test Methods (JIS C 5201-1 ):

ΔR after 5 cycles:-55°C ±3°C 30 min.Room temp. 10-15 min.+155°C ±2°C 30 min.4 Room temp. 10-15 min.

ΔR:

No evidence of flashover, mechanical damage, arcing or insulation breakdown

Test Methods (JIS C 5201-1 ):

Clamped in the trough of a 90°C metal-lic v-block at specified AC potential 60-70 sec.0

Derating

Res As Smd Derating

Reflow

Res As Smd Reflow

Pulse Curve

Res As Smd  Pulse 1
Res As Smd  Pulse 2

Lightning Surge

Res AS Smd Surge

Dimensions

L: 2.00 ±0.15

W: 1.25 +0.15/-0.10

H: 0.55 ±0.10

a: 0.40 ±0.20

b: 0.40 ±0.20

L: 3.10 ±0.15

W :1.55 +0.15/-0.10

H: 0.55 ±0.10

a: 0.45 ±0.20

b: 0.45 ±0.20

L: 6.35 ±0.10

W: 3.10 ±0.150

H: 0.55 ±0.10

a: 0.60 ±0.25

b: 0.50 ±0.20

Res As Smd Dimensions 1

 

Tape and Reel

Packaging:

Paper

Qty./reel:

5,000 pcs.

A: 1.65

B: 2.40

T: 0.81

W: 10

Packaging:

Paper

Qty./reel:

5,000 pcs.

A: 2.00

B: 3.60

T: 0.81

W: 10

Packaging:

Embossed

Qty./reel:

4,000 pcs.

A: 3.50

B: 6.70

T: 1.0

W: 13.8

Res As Smd Tape and Reel 1

Paper

Res As Smd Tape and Reel 2

Embossed

Res As Smd Tape and Reel 3

 

 

 

 

A: 1.3

B: 1.2

C: 1.0

A: 1.8

B: 1.2

C: 2.2

A: 3.0

B: 2.5

C: 4.0

 

Land Pattern

Res As Smd Land Pattern

Ordering Information

Res As Smd Order Info

 

Standard Part Numbers 

 

0805

AS08J1R00ET
AS08J10R0ET
AS08J1000ET
AS08J1001ET
AS08J1002ET
AS08J1003ET
AS08J1004ET

 

1206

AS12J1R00ET
AS12J10R0ET
AS12J1000ET
AS12J1001ET
AS12J1002ET
AS12J1003ET
AS12J1004ET

 

2512

AS25J1R00ET
AS25J10R0ET
AS25J12R0ET
AS25J15R0ET
AS25J22R0ET
AS25J1000ET
AS25J1001ET
AS25J1002ET
AS25J1003ET
AS25J1004ET

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