JR Series Datasheet

High Power Jumper Chip

The Ohmite JR series high current jumpers are rated up to 100 amps and provides a max resistance range of 0.5m to 0.2m ohms. This minimizes effects on the designed circuit. Five industry sizes are available. The JR series also provides great insulation resistance over 100M ohms

Features

Six standard sizes - 0201 through 2512
Max resistance below 0.2m ohms
Max current handling of 100 amps
Max derating temperature of 170°C (2512)

Series Specifications

Max.Res.(mΩ):

1.0

Max.Current(A):

8

Loading**:

0.064W

Max.Res.(mΩ):

0.5

Max.Current(A):

20

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0.2W

Max.Res.(mΩ):

0.2

Max.Current(A):

26

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0.135W

Max.Res.(mΩ):

0.2

Max.Current(A):

35

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0.245W

Max.Res.(mΩ):

0.2

Max.Current(A):

40

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0.32W

Max.Res.(mΩ):

≤0.2

Max.Current(A):

100

Loading**:

2W

**based on specific pad layout specific current

Characteristics

100MΩ

70°C

-55°C~150°C; 2512: -55 +170°C

Cu

Temperature : 25±5°CHumidity : 60±20%Airtight in temp. 10°C~40°C, relative humidity 75% can store 2 years. Without dew in temp. 10°C~60°C, relative humidity 95% max. value for 30 days.

Performance

0201, 0402, 0603, 0805, 1206

Procedure:

T = +150 ±2ºC; t = 1000h; IEC60115-1 4.25

Requirement:

< Rmax

Procedure:

T = -55±2ºC; t = 1000h; IEC60115-1 4.25

Requirement:

< Rmax

Procedure:

(60°C, 95%RH) Vtest = Vmax; T=60±2ºC; RH=95%; t= 90min ON, 30min OFF, 1000h; IEC60115-1 4.25

Requirement:

< Rmax

Procedure:

-55ºC 30min.; R.T. 3min.; +150ºC 30min.; R.T. 3min); 100Cycles; IEC60115-1 4.19

Requirement:

< Rmax

Procedure:

Vtest = Vmax; T=70 ±2ºC; t= 90min ON, 30min OFF,1000h; IEC60115-1 4.25

Requirement:

< Rmax

Procedure:

Dip into solder at T = 245±5ºC, t = 3 ±0.5 sec.; IEC60115-1 4.17

Requirement:

95% coverage

Procedure:

Through Reflow; T= 275 ±5ºC, t =20 ±1sec.; IEC60115-1 4.18

Requirement:

< Rmax

2512

Procedure:

4x rated power, 5 sec.; JIS C 5201-1 4.13

Requirement:

≤0.2mΩ

Procedure:

-55°C to 150°C, 1000 cy., 15 min. at each extreme; JIS C 5201-1 4.23.2

Requirement:

≤0.2mΩ

Procedure:

1000 hrs. at 170°C

Requirement:

≤0.2mΩ

Procedure:

1000 hrs. at 85°C/85%RH, 10% bias 1.5 hrs. on, 0.5 hrs. off; JIS C 5201-1 4.24

Requirement:

≤0.2mΩ

Procedure:

1000 hrs. at 70°C, 1.5 hrs. on, 0.5 hrs. off; JIS C 5201-1 4.25

Requirement:

≤0.2mΩ

Procedure:

245 ±5ºC, 2 ±0.5 sec.; JIS C 5201-1 4.17

Requirement:

95% coverage

Derating

Construction

0201-1206

2512

Soldering

Wave Soldering

Preheating : 100~130°C, max.100 sec.

Soldering: 250~265°C max. 10 sec.

Max. temp.: 260 ±5°C, max. 10 sec

Reflow Soldering

Preheating: 145 ±15°C, max.120 sec.

Soldering: min. 220°C, max. 60 sec.

Max. temp.: 260±5°C, max. 10sec.

Reflow Soldering: 2512 Size

Preheating: 150°~180°C, max.120 sec.

Soldering: min. 230°C, max. 40 sec.

Max. temp.: 250±5°C, max. 10sec.

Rework temperature: (hot air equipment) 350°C, 3~5 seconds Recommended reflow methods: IR, vapor phase oven, hot air oven. If reflow temperatures exceed the recommended profile, devices may not meet the per- formance requirements.

Dimensions

0201-1206 size

2512 size

Land pattern

W:

0.30 ±.04

L:

0.60 ±.03

H:

0.25 ±.10

T1:

-

T2:

0.15 ±.06

A:

0.33

B:

0.20

C:

0.25

W:

0.50 ±.20

L:

1.00 ±.20

H:

0.35 ±.20

T1:

-

T2:

0.20 ±.15

A:

0.60

B:

0.60

C:

0.40

W:

0.80 ±.20

L:

1.60 ±.20

H:

0.35 ±.20

T1:

-

T2:

0.35 ±.20

A:

0.92

B:

1.30

C:

0.60

W:

1.25 ±.20

L:

2.00 ±.20

H:

0.35 ±.20

T1:

-

T2:

0.35 ±.20

A:

1.44

B:

1.40

C:

0.80

W:

1.60 ±.20

L:

3.20 ±.20

H:

0.50 ±.20

T1:

-

T2:

0.50 ±.20

A:

1.84

B:

1.80

C:

1.20

W:

3.05 ±.25

L:

6.35 ±.25

H:

0.67 ±.25

T1:

0 ~ 0.20

T2:

1.10 ±.25

A:

3.68

B:

2.11

C:

3.18

Tape And Reel

(mm)

Paper/PE tape

sizes 0201 & 0402

sizes 0603, 0805, 1206

Embossed/blister tape

size 2512

W:

8.00 ±.30

P0:

4.00 ±.10

P:

2.00 ±.10

P2:

2.00 ±.10

A0:

0.38 ±.10

B0:

0.68 ±.10

D0:

1.50 ±.10

D1:

-

F:

3.50 ±.10

E:

1.75 ±.10

T:

0.45 ±.05

T1:

Max. 0.1

K0:

0.30 ±.05

W:

8.00 ±.30

P0:

4.00 ±.10

P:

2.00 ±.10

P2:

2.00 ±.10

A0:

0.75 ±.20

B0:

1.25 ±.20

D0:

1.50 ±.10

D1:

-

F:

3.50 ±.10

E:

1.75 ±.10

T:

0.50 ±.05

T1:

Max. 0.1

K0:

0.40 ±.05

W:

8.00 ±.30

P0:

4.00 ±.10

P:

4.00 ±.10

P2:

2.00 ±.10

A0:

1.18 ±.20

B0:

1.98 ±.20

D0:

1.50 ±.10

D1:

-

F:

3.50 ±.10

E:

1.75 ±.10

T:

0.58 ±.10

T1:

-

K0:

-

W:

8.00 ±.30

P0:

4.00 ±.10

P:

4.00 ±.10

P2:

2.00 ±.10

A0:

1.55 ±.20

B0:

2.30 ±.20

D0:

1.50 ±.10

D1:

-

F:

3.50 ±.10

E:

1.75 ±.10

T:

0.58 ±.20

T1:

-

K0:

-

W:

8.00 ±.30

P0:

4.00 ±.10

P:

4.00 ±.10

P2:

2.00 ±.10

A0:

2.05 ±.20

B0:

3.65 ±.20

D0:

1.50 ±.10

D1:

-

F:

3.50 ±.10

E:

1.75 ±.10

T:

0.75 ±.20

T1:

-

K0:

-

W:

12.0 ±.30

P0:

4.00 ±.10

P:

4.00 ±.10

P2:

2.00 ±.10

A0:

3.50 ±.10

B0:

6.75 ±.10

D0:

1.50 +.1/-0

D1:

1.55 ±.10

F:

5.5 ±.10

E:

17.5 ±.10

T:

0.90 ±.10

T1:

0.20 ±.05

K0:

-

0201-1206

2512

qty/reel:

10,000

weight per 1K pc. (g):

100 ±30

qty/reel:

10,000

weight per 1K pc. (g):

100 ±30

qty/reel:

5,000

weight per 1K pc. (g):

140 ±30

qty/reel:

5,000

weight per 1K pc. (g):

160 ±30

qty/reel:

5,000

weight per 1K pc. (g):

180 ±30

qty/reel:

4,000

weight per 1K pc. (g):

210 ±30

Ordering Information

Max.Res.(mΩ):

1.0

wMax.Current(A):

8

Max.Res.(mΩ):

0.5

wMax.Current(A):

20

Max.Res.(mΩ):

0.2

wMax.Current(A):

26

Max.Res.(mΩ):

0.2

wMax.Current(A):

35

Max.Res.(mΩ):

0.2

wMax.Current(A):

40

Max.Res.(mΩ):

≤ 0.2

wMax.Current(A):

100

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JR Series Datasheet

High Power Jumper Chip

Features

Series Specifications

Characteristics

Performance

0201, 0402, 0603, 0805, 1206

2512

Derating

Construction

0201-1206

2512

Soldering

Wave Soldering

Reflow Soldering

Reflow Soldering: 2512 Size

Dimensions

0201-1206 size

2512 size

Land pattern

Tape And Reel

Paper/PE tape

sizes 0201 & 0402

sizes 0603, 0805, 1206

Embossed/blister tape

size 2512

0201-1206

2512

Ordering Information

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