Applications
- Industrial electronics, power electronics: power supply, DC/DC converter, AC/DC converter, motor controller, automotive electronics
- Battery charger, PC, PDA, 3C products, Telecommunications, instruments, white goods
Features
- NiCu or MnCu resistive alloy; material TCR ±10ppm/°K
- Marking epoxy UL-94-V0 conformal
- 96% alumina substrate thermo dissipation protective layer
- Cu Terminal Electrode with Pb Free termination (60% Sn, 40% Ni)/li>
- Flame-retardant epoxy protective coat (UL-94-V0)
- Ultra low resistance value (0.005Ω ~ 0.050Ω)
- Precision resistance alloy (NiCr20AlSi, or CuMnNi); material selected for low TCR (<50ppm/°C)
- Low inductance, low thermo EMF (<50µV/°C)
Series Specifications
Characteristics
Derating
Recommended Solder Profile
Preheating: 145°C ±15°, max. 120 sec.
Soldering: min. 220°C, max. 60 sec.
Max. Temp.: 260°C ±5°, 10 sec.
Performance Characteristics
Dimensions
(in./mm)
Land Pattern
Packaging
(mm)
MCS1320, MCS1632
MCS3264