TAH Serie Datasheet

0.05Ω to 10KΩ, other values available upon reques

<0.1Ω: 5% only0.1Ω-1MΩ: 5% std.; 1% available

Referenced to 25°C, ∆R taken at +105°C; 1 to 10Ω: ±(100ppm+0.002Ω)/°C 10Ω & up: ±50ppm/°C

350V

1,800 VAC

20W @ 25°C case temperature; see derating curve, below

10GΩ min.

2x rated power for 5 seconds where applied voltage ≤1.5 times max. operating voltage. ∆R ±(0.3% + 0.001Ω) max.

KMC-125 epoxy

Copper

Lead Free Solder (97% Tin, 3% Silver)

Requires the use of a snap-on style heat sink. A thermal compound should be properly applied.

The TAH20 cannot exceed 260°C for more than 10 seconds during soldering process.

MIL-R-39009, 2000 Hours @ Rated Pwr

∆R = ±(1.0% + 0.001) Ω

MIL-R-STD-202, Method 107, Cond. F

∆R = ±(0.3% + 0.001) Ω max

MIL-R-STD-202, Method 204, Cond. D

∆R = ±(0.2% + 0.001) Ω max

MIL-R-STD-202, Method 211, Cond. A (Pull Test) 2.4N

∆R = ±(0.2% + 0.001) Ω max

MIL-R-STD-202, Method 106

∆R = ±(0.5% + 0.01) Ω max