The TAP series delivers 1000W or 2000W of continuous power when properly mounted to a liquid cooled heat sink (based on 85°C mounting plate temperature) Applications include power conditioning, power distribution, power conversion, and power control.
Applications
- Power semiconductor balancing
- Motor control
- Inrush Current Limiting
Features
- High Energy Rating
- Low Inductance
- Resistor Element Electrically Isolated
- High Dielectric Strength
- Small Footprint
Characteristics
Derating
Dimensions
(in./mm)
Applications Note
Proper heat sinking techniques are essential to performance of a TAP resistor. Pleased follow these guidelines when designing TAP system:
- Heats sink plate (base plate of the resistor) temperature must be monitored to establish proper de-rating. Best technique is to attach a thermocouple to the side of the base plate of the resistor. Temperature of plastic housing or heat sink cannot be used to establish rating of the resistor. Usage of laser thermometers should be avoided.
- To obtain a power rating of 1000W or 2000W, the bottom case temp must not exceed 85°C. This can only be achieved if the thermal conduction to the heatsink Rth-cs<0.025°K/W. This value can be reached by using thermal transfer compound with a heat conductivity of 1W/mK. The flatness of the cooling plate must be better than 0.05mm overall. The roughness of the surface should not exceed 6.4µm.
- Due to very high power density, only liquid cooled heat sinks are recommended for applications when >300W power rating is desired.
- Properly designed heat sink should have more than 2 cooling pipes under the surface of the TAP resistor. The Ohmite CP4 heat sink (https://www.ohmite.com/cp4-series-chillplate/) is an example of properly designed heat sink
Ordering Information
Standard Part Numbers
1000 Watt 10% Tolerance