TAP650 Series Datasheet

650W at 85°C bottom case temp. (Please ask for detailed mounting procedure! This value is only applicable if using thermal conduction to the heat sink Rth-cs< 0.117°K/W. This value can be obtained by using a thermal transfer compound with a heat conductivity of 8.55 W/mK. The flatness of the cooling plate must be better than 0.05mm overall. Surface roughness should not exceed 6.4μm.)

0.25Ω to 1MΩ (others upon request). Values below 1 ohm are measured at max lead length

±5% to ±10%

±150 ppm/°C (others upon request)

5,000VDC, higher voltage upon request, not exceeding max. power

1,000 W at 70°C for 10sec., delta-R = 0.4% max.

650W at 85°C bottom case temperature (others upon request)

up to 1,500A depending on pulse length and frequency. Please ask for details!

6kVrms, 50 Hz,up to 12 kVrms upon special request.

up to 12kV norm wave (1.5/50 μsec)

4KVrms, < 10 pC, up to 7kV upon special request

10 GΩ min. at 500V

80nH (typical)

110 pF

40 pF

res. body: -55°C to +150°C; std. cables: -40°C to +120°C (other cables upon request)

1.8 Nm, M4 screws

According to UL94-V0

0° to 85°C at 80% RH max. for min. 12 months. For different conditions please contact factory

8.55W/°K (0.117°K/W)

Method:

1,000W/10sec

Typical results:

0.4%

Method:

56 days/40°C/95%

Typical results:

0.25%

Method:

-55°/+125°/5 cycles

Typical results:

0.20%

Method:

40g/4,000 times

Typical results:

0.25%

Method:

2-500Hz/10g

Typical results:

0.25%

Method:

3,000cyl; Pn 30 min. on / 30 min off

Typical results:

0.40%