TDH Series Datasheet

Copper

Terminals- SnAg, Thermal Header- German Silver/Nickel Silver

0.05Ω to 10KΩ other values on request

±1% to ±10% (0.5% on request)

350V

10GΩ min.

Depends upon case temperature. See der-ating curve.D2PAK style power package for surface mounting applications; 35W power rating at 25°C case temperature.

-55°C to +175°C

The TDH35P cannot exceed 215°C (260°C for the TDH35H)

100% @ 25°C to 0% @ 150°C curve referenced to case temperature

1,800VAC

-55°C to +150°C

Referenced to 25°C, ∆R taken at +105°C10Ω and above: ±50 ppm°CFor under 10Ω:3R to 9R9: 100ppm1R to 2R9: 300ppm0R1 to 0R99: 700ppm0R05 to 0R09: 1000ppm

less than 20 nanohenries

less than 0.1mm tolerance

During surface mount soldering the soldering temperature profile must not cause the metal tab of this device to exceed 215°C (260°C for the TDH35H)!

Condition:

MIL-R-39009, 2,000 hours

Result:

∆R ±(1.0% +0.01Ω)

Condition:

MIL-Std-202, Method 106

Result:

∆R =(0.5% +0.01Ω) max.

Condition:

2 times rated power with applied voltage not to exceed 1.5 times maximum continu-ous operating voltage for 5 seconds

Result:

∆R ±(0.3% +0.01Ω) max.

Condition:

MIL-Std-202, Method 107, Cond. F

Result:

∆R =(0.3% +0.01Ω) max.

Condition:

MIL-Std-202, Method 211, Cond. A (Pull Test) 2.4N

Result:

∆R =(0.2% +0.01Ω) max

Condition:

MIL-Std-202, Method 204,Cond. D

Result:

ΔR =(0.2% +0.01Ω) max.