Thick Film on Alumina Substrate
Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package configuration which dissipates heat well above board level.
Ohmite’s power chip resistors have a 125% higher operating temperature range than competitive products of similar design. High-temperature solder and in-process plating keep terminations secure under self-heating effects by preventing re-flow from full power operation. Flexible packaging schemes make these resistors ideal for power supplies, audio amplifiers, video flyback, and other power control applications.