TX Series Datasheet

Thick Film Chip Thermistor

Features

High mechanical strength and reliability are available due to thermistor film and glass-coated structure on alumina substrate
Thickness does not change on any resistance value
High solder ability and heat resistance are available due to triple structure electrodes
AEC -Q200 is available
UL1434 can be available in some parts
Some parts can resist in operating temperature range up to 150°C

Specifications

Size:

0805

Dissipation Factor* in Air ∂≤1.5mW/°C:

1.3 mW/°C

Thermal TimeConstant in Airτ≤5.0 sec.:

2.5 sec.

Rated Power(25°C):

130mW

Size:

0603

Dissipation Factor* in Air ∂≤1.5mW/°C:

1.2 mW/°C

Thermal TimeConstant in Airτ≤5.0 sec.:

2.0 sec.

Rated Power(25°C):

120mW

Size:

0402

Dissipation Factor* in Air ∂≤1.5mW/°C:

1.1 mW/°C

Thermal TimeConstant in Airτ≤5.0 sec.:

1.5 sec.

Rated Power(25°C):

110mW

*Dissipation factor values depend on measurement procedure and materials used.

Characteristics

±1%, ±2%, ±3%, ±5%, ± 10%

Determined by zero-power resistance at 25°C and 85°C

±1%, ±2%, ±3%, ±5%

-40 ~ +125°C

5mW

Standard Resistance Range @25°C

B-value (25°C/85°C) :

TX08:

25K~500K

TX06:

50K~2M

TX04:

75K~1M

TX08:

15K~400K

TX06:

20K~1M

TX04:

45K~500K

TX08:

10K~100K

TX06:

15K~200K

TX04:

30K~100K

TX08:

3K~100K

TX06:

5K~200K

TX04:

8K~100K

TX08:

1K~50K

TX06:

2K~100K

TX04:

4K~50K|

TX08:

500~30K

TX06:

1K~50K

TX04:

1.5K~30K

TX08:

500~30K

TX06:

1K~50K

TX04:

1.5K~30K

TX08:

500~30K

TX06:

1K~50K

TX04:

1.5K~30K

TX08:

400~10K

TX06:

650~20K

TX04:

1.2K~10K

TX08:

250~5K

TX06:

400~10K

TX04:

750~5K

TX08:

80~2K

TX06:

100~5K

TX04:

270~2K

TX08:

50~1K

TX06:

80~2K

TX04:

150~1K

Resistance Temperature Characteristics

Soldering

Solder: Pb-free solder Sn-3.0Ag-0.5Cu

Flow

Reflow

Dimensions

Inch size: 0805

L: 2.00 ±0.20

W: 1.25 ±0.20

t: 0.55 ±0.10

b: 0.40 ±0.20

Qty/reel: 5,000

Inch size: 0603

L: 1.60 ±0.15

W: 0.80 ±0.15

t: 0.50 ±0.10

b: 0.30 ±0.20

Qty/reel: 5,000

Inch size: 0402

L: 1.00 ±0.05

W: 0.50 ±0.05

t: 0.35 ±0.05

b: 0.25 +0.05/-0.10

Qty/reel: 10,000

Packaging

(mm)

Type: Rectangular punched carrier system

Carrier tape: Paper

Top cover tape: Thermal adhesion plastics

Bottom cover tape: Thermal adhesion paper

Unreeling direction →

Unreeling direction →

A: 0.65 ±0.10

B: 1.15 ±0.10

W: 8.00 ±0.20

F: 3.50 ±0.05

E: 1.75 ±0.10

P1: 2.00 ±0.05

P2: -

P0: 4.00 ±0.10

D0: 1.55 ±0.05

t1: 0.50max

t2: 1.00max

Qty./reel: 10,000

A: 1.10 ±0.20

B: 1.90 ±0.20

W: 8.00 ±0.20

F: 3.50 ±0.05

E: 1.75 ±0.10

P1: 4.00 ±0.10

P2: 2.00 ±0.05

P0: 4.00 ±0.10

D0: 1.55 ±0.05

t1: 1.00max

t2: 1.40max

Qty./reel: 5,000

A: 1.65 ±0.20

B: 2.40 ±0.20

W: 8.00 ±0.20

F: 3.50 ±0.05

E: 1.75 ±0.10

P1: 4.00 ±0.10

P2: 2.00 ±0.05

P0: 4.00 ±0.10

D0: 1.55 ±0.05

t1: 1.00max

t2: 1.40max

Qty./reel: 5,000

Pitch tolerance over any 10 pitches of P0 is ±0.2mm

Strength of carrier tape and cover tape: 10N(1.02kgf) or more
Peel force of top cover tape: 5~70gf (Peeling angle = 165~180°, peeling
speed = about 200mm/min.)

← Direction of unreeling

Ordering Information

Standard Part Numbers

B25/85: 3435K

B25/85: 4100K

B25/85: 3950K

B25/85: 3380K

B25/85: 3435K

B25/85: 4100K

B25/85: 4500K

B25/85: 3990K

B25/85: 4390K

B25/85: 3450K

B25/85: 3480K

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TX Series Datasheet

Thick Film Chip Thermistor

Features

Specifications

Characteristics

Standard Resistance Range @25°C

Resistance Temperature Characteristics

Soldering

Flow

Reflow

Dimensions

Packaging

Ordering Information

Standard Part Numbers

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Contact Our Team of Experts Today

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