Ohmite introduces the VR series heatsink (Pat. Pending). This series offers a low profile, large surface area and is configurable using a universal cam clip system. The VR series is degined to accommodate TO-220, TO-247, and high power IXYS packages. The VR series is thru hole soldered onto PCBs and is ideal for compact (1U or 2U) packaging with forced convection cooling.
Specifications
* Note: Anodized parts are standard; degreased available on request.
Characteristics
Thermal Performance
Power Dissipation is 10W, for L=27m, single device, 20W for L=55mm, double devices
Heat Load Area 18mm X 23mm, metal tab
Use T-pcm as Thermal Interface Material or other TIMs, but the thickness must be smaller than 0.01"
Ducted Air Flow
Dimensions
Ordering Information
