Features
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Ultra-low ohmic value series for Current Sensing applications
- Very low inductance (<1nH at 1MHz Test)
- Miniaturized dimensions, Better power to dimension ratios
- Use of the highest quality standard (96% Alumina)
ceramic core - Manufacturing process–Wire winding/Spot
Welding–by Computer Numerical Control (CNC)
machine tools to ensure consistency of product
quality. - Encapsulated by epoxy molding compound
- Advanced IC encapsulation mold/die technologies
Specifications
Characteristics
Derating
Performance Data
Dimensions
Ordering Information