The C40 Series Heat Sink System (Patent Pending) offers flexible, high performance and compact heatsinks with an exchangeable cam clip system for TO-247, TO-264 devices. This powerful heat sink can be thru-hole soldered in single or paired configurations. When two single units are mounted back-to-back a mounting hole configuration is created. This configuration can accommodate a 40mm x 40mm fan. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection.