Designed for TO-126, TO-220, TO-247 and TO-264 devices. This extruded heatsink offers multiple lengths and sizes. Each extrusion utilizes the patented clipping system. This system requires on tools and can lock in the device with on finger. The cam locking system engages the device securely for a proper thermal connection. The C series from Ohmite is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling.