Ohmite introduces the patented M series. The multiple advantages of this Ohmite M series heatsink are high performance, low cost, configurable, scalability, and compact design. The M series heatsink with matrix clip system for TO-247 and TO-264 packages eliminates the use of fastener hardware. This powerful heat sink provides the easiest assembly, largest surface area, and the smallest footprint. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling. Ohmite provides the M series in multiple extrusion lengths and two different forms.