Thermal Pads for Heatsinkable Devices

Thermal Interface Material

There are multiple high power heatsinkable devices on the market. Most if not all require pastes, materials, or grease between the heatsink and the device to meet its full potential. Turn to Ohmite for your Thermal Interface Material (TIM) solutions. Ohmite offers TIM's specifically cut to device footprints with no messy grease or paste. The Ohmite TIM's fill air voids and do not require a re-torque creating a quicker assembly process.

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Thermal Pad

Thermal Pad

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